Teledyne FLIR OEM Unveils Boson+ IQ Thermal Development Kit at 2025 DSEI UK Exhibition
Goleta, California. – Teledyne FLIR OEM, a division of Teledyne Technologies Incorporated, has unveiled the Boson®+ IQ Development Kit. This innovative solution combines reference hardware with Prism™ software, enabling integrators to swiftly develop edge AI capabilities using advanced thermal sensing for defense, security, and industrial applications.
The kit features the Teledyne FLIR OEM AVP, utilizing the Qualcomm® Dragonwing™ QCS8550 system-on-chip (SoC), which achieves 50 trillion operations per second (TOPS) with a power consumption of just 2.5 watts. Its multicore architecture supports Prism AI object detection models and Prism ISP features, offering enhanced image clarity through denoising and super resolution in challenging conditions.
Jared Faraudo, vice president of product management and programs at Teledyne FLIR OEM, stated that the Boson+ IQ Dev Kit marks a significant advancement for integrators developing smarter thermal systems with AI, particularly in autonomy applications such as drones, loitering munitions, and robotics. By pairing the Boson+ thermal camera with Prism AI and ISP software on a Qualcomm platform, it enables quicker development processes, superior image quality, and extended mission duration with minimal power use.
The kit is designed for adaptability and scalability, featuring interface and carrier boards with three MIPI interfaces, which allow developers to integrate visible or other sensors into their systems. It includes the Boson+ and Prism SDKs, hardware interface control documentation (ICD), and expert engineering support, facilitating a smooth development journey from prototype to deployment.
Prepared for future enhancements, the Boson+ IQ Development Kit is compatible with upcoming features, such as Prism SKR and Prism Supervisor. Prism SKR aids in autonomous target detection and terminal guidance, while Prism Supervisor enables autonomous operation to specified way points through GPS or visual-based navigation (VBN) technology. These capabilities can enhance mission-critical applications in defense, security, and industrial automation.
The Boson+ IQ Development Kit will be showcased at the Teledyne FLIR stand (#S3-110) during DSEI UK at ExCeL London, from September 9 to 12, a leading defense and security exhibition. For further details, visit https://oem.flir.com/products/boson-plus-iq-development-kit/.
About Teledyne FLIR
Teledyne FLIR, part of Teledyne Technologies, is a leader in intelligent sensing solutions for defense and industrial applications, employing about 4,000 people globally. Since its founding in 1978, the company has developed advanced technologies to help professionals make timely decisions that save lives and livelihoods. More information is available at www.teledyneflir.com or through their social media at @flir.
About Teledyne Technologies
Teledyne Technologies provides high-tech digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Their operations are mainly based in the United States, the United Kingdom, Canada, and Europe. Additional information can be found on Teledyne's website at www.teledyne.com.
